Reactive high power impulse magnetron sputtering

Tomáš Kubart, Jon Tomas Gudmundsson, Daniel Lundin

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

3 Citations (Scopus)


Reactive magnetron sputtering is essential in many industrial processes where it is applied to deposit compound films or coatings. Reactive sputtering is attractive because a range of compounds can be prepared from a low-cost metal target by addition of an appropriate reactive gas to the noble working gas. To understand the reactive HiPIMS process, we here start with an overview of reactive sputtering and an introduction to process hysteresis in dcMS, which is followed by an overview of fundamental surface and plasma processes focusing on the behavior specific for reactive sputtering. In the second half of the chapter, HiPIMS-specific aspects of reactive sputtering are reviewed. This includes hysteresis in reactive HiPIMS operation, which is the subject of much debate, as some report reduction or elimination of the hysteresis effect, while others claim that a feedback control is essential. To provide a deeper insight into the process physics, a combination of experimental and computational model results are presented and discussed throughout the text.

Original languageEnglish
Title of host publicationHigh Power Impulse Magnetron Sputtering
Subtitle of host publicationFundamentals, Technologies, Challenges and Applications
Number of pages41
ISBN (Electronic)9780128124543
ISBN (Print)9780128124550
Publication statusPublished - 1 Jan 2019

Bibliographical note

Publisher Copyright:
© 2020 Elsevier Inc. All rights reserved.

Other keywords

  • Compound formation
  • Hysteresis
  • Plasma chemistry
  • Reactive gas
  • Reactive magnetron sputtering


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